Solders and Soldering

Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects

Lead-free soldering, originally started as an environmental issue, is evolving rapidly into a business survival tool for the worldwide electronic industry. Promising lead-free solder alternatives for surface mount assembly applications include eutectic Sn/Ag, eutectic Sn/Cu, Sn95/Sb5, eutectic Sn/Bi, Sn/Ag/Cu, Sn/Ag/Cu/X, Sn/Bi/Ag/X, Sn/Zn/X, and Sn/In/Ag/(X). However, for wafer level area arra...

0 Canonical Transformations and Soldering

We show that the recently developed soldering formalism in the Lagrangian approach and canonical transformations in the Hamiltonian approach are complementary. The examples of gauged chiral bosons in two dimensions and self-dual models in three dimensions are discussed in details.

Ersa wave soldering systems

On Soldering Chiralities

We study how to solder two Siegel chiral bosons into one scalar field in a gravitational background. Permanent address: Instituto de F́ısica, Universidade Federal do Rio de Janeiro, Brasil [email protected] [email protected]

Brazing & Soldering Today

JULY 2012 50 High-temperature solder alloys are extensively used in dieattach, power semiconductor, and optical device packaging, flip-chip packaging, etc. Current industry standard solders for these applications are mainly high-lead solders (90–97 wt-% Pb) and gold-based eutectic solder alloys such as the 80Au20Sn solder. The die-attach process involves connecting the silicon die or chips to a...